Cold Planing (CP), commonly referred to as milling or profiling, is the controlled removal of the surface of an existing pavement to the desired depth or cross-slope with specially designed equipment capable of removing portions of the pavement surface to the specified grade and/or cross-slope. CP can be used in excavation, reconstruction, rehabilitation and maintenance operations.
CP allows for removal of a controlled amount of material vs complete new construction. Creating and utilizing RAP means less need for new materials, reducing costs
Reuse of resources eliminates greenhouse gases from the production of those resources. Can be as high as 50-60%.
Saves up to 60% in HMA plant and 100% in other processes by creating RAP for the reuses of existing pavement materials.
Save time by keeping guard rails, overpasses, etc. at the same height in relation to roadway eliminating the need to adjust their height.
Extends the life of the pavement structure by correcting smoothness issues, drainage issues and removing some top down cracking and raveling.
Issues Addressed
Raveling
Bleeding
Shoulder drop off
Rutting
Corrugations
Shoving
Removal of deteriorated, stripped or aged asphalt
Poor ride quality caused by swells, bumps, sags and depressions
Diminished curb reveal heights
Attributes
Restores pavement smoothness
Corrects grade and cross-slope issues
Restores pavement surface friction
Serves as a surface or grade preparation for other maintenance/rehabilitation techniques
Common Combinations
Cold Planing + HMA Overlay
Cold Planing + With CIR or CCPR
Cold Planing + single or double chip seal
Micro milling + thin HMA overlay
Micro milling + ultra-thin bonded wearing course
Micro milling + Micro or Slurry surfacing
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